![]() ![]() ![]() As excessive growth of intermetallic compounds affects the mechanical integrity of solder joints negatively due to their brittle behavior, 90iSC alloy permits maintaining a stable interconnection with more than 75% original solder joint strength after thermal cycling. Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. HARIMA offers a complete range of MULTiCORE solder paste solutions in the 90iSC alloy which are capable of exceeding the challenges of harsh environments. ![]() This, in combination with its solderability when integrated with the appropriate flux system, makes 90iSC alloy the world’s leading high reliability, lead-free, solder alloy. When subjected to thermal cycling, thermal shock, and thermal ageing, 90iSC alloy is unmatched. 90iSC alloy has the ability to provide high creep and strain resistance within operating temperatures up to 150☌. For stencil printing you can obtain lead-free, temperature-stable, No Clean solder paste (SAC305) with a very good lifetime from Felder and Loctite in. Tough, durable, adaptable, and high-temperature capable, 90iSC alloy is the lead-free benchmark for high reliability applications. If you’re finding that solder just won’t flow, or if you need something to pre-dope. When traditional SAC alloys can’t deliver safety-critical performance, HARIMA’s 90iSC alloy is the answer. Best Beginner Rosin Paste Flux Sra Rosin Paste Flux 135 No clean is great, but it’s a pretty weak flux. HARIMA’s 90iSC alloy was designed for applications and markets where extreme temperature resistance and reliability are non-negotiable and lead-free compliance is required. ![]()
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